以某羧酸盐的水溶液作为走位剂(即覆盖能力促进剂),可提高形状复杂的小零件滚镀光亮铜锡时的走位能力.改进后的镀液配方及工艺参数为:CuCN 10～20g/L,游离NaCN 12～24g/L,SnCl_2 0.5～1.0g/L,Na_2HPO_4 90～100 g/L,明胶0.1～0.2 g/L,走位剂25～35mL/L,温度45～55℃,pH 10.5～11.5,电压8～9V,电流300～350A/桶,以电解铜板为阳极.
The throwing power of bright copper-tin barrel plating on small shape-complicated workpiece can be improved by using an aqueous carboxylate solution for enhancing covering power. The improved bath formulation and process parameters are as follows: CuCN 10-20 g/L, NaCN 12-24 g/L, SnCl_2 0.5-1.0 g/L, Na_2HPO_490-100 g/L, gelatin 0.1-0.2 g/L, covering power enhancer 25-35 mL/L, temperature 45-55℃, pH 10.5-11.5, voltage 8-9 V, current 300-350 amperes per barrel, and electrolytic copper sheet as anode.
参考文献
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%