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研磨介质的化学作用对于固结磨料研磨的材料去除率和表面质量具有至关重要的影响.采用不同的酸性介质对镁铝尖晶石样品进行研磨,研究了其对镁铝尖晶石固结磨料研磨的材料去除率和表面质量的影响;采用电感耦合等离子质谱仪(ICP)测量了不同酸性介质对镁铝尖晶石工件和研磨垫的化学腐蚀作用,并进一步采用电化学工作站检验了不同酸性介质对研磨垫填料铜的腐蚀性能.结果表明:研磨介质对填料铜的化学腐蚀促进研磨垫的自修整是其对研磨过程材料去除率产生影响的主要因素,其中3%乙酸研磨后的材料去除率最大,可达249.97 nm/min;研磨介质对工件的化学作用可以改善工件的表面质量,其中3%磷酸研磨后的工件表面粗糙度值最小,仅为72.4 nm.

参考文献

[1] 李祯;雷牧云;王立弟.增强型镁铝尖晶石透明陶瓷的制备[J].陶瓷学报,2012(4):488-491.
[2] Pirayesh, H.;Cadien, K..Chemical mechanical polishing in the dry lubrication regime: Application to conductive polysilicon[J].Journal of Materials Processing Technology,2015:257-263.
[3] 赵清亮;孙智源;郭兵.碳化硅圆柱槽微结构表面的化学机械抛光[J].机械工程学报,2015(15):183-189.
[4] Xu, Li;Zou, Chunli;Shi, Xiaolei;Pan, Guoshun;Luo, Guihai;Zhou, Yan.Fe-N-x/C assisted chemical mechanical polishing for improving the removal rate of sapphire[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2015Jul.15(Jul.15):115-120.
[5] Jiang, Liang;He, Yongyong;Luo, Jianbin.Chemical mechanical polishing of steel substrate using colloidal silica-based slurries[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2015Mar.1(Mar.1):487-495.
[6] 唐晓骁;朱永伟;付杰;王成;居志兰.铜粉含量对亲水性固结磨料抛光垫加工性能的影响研究[J].金刚石与磨料磨具工程,2012(4):10-13.
[7] Wang Zhan-kui;Wang Zhuan-kui;Zhu Yong-wei;Su Jian-xiu.Effect of lapping slurry on critical cutting depth of spinel[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2015Aug.30(Aug.30):849-855.
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