采用直流磁控溅射方法制备FePt/Cu多层膜, 再经不同温度下真空热处理得到有 序L10-(FePt)100-xCux薄膜. 结果表明, Cu的添加可以降低FePt 薄膜有序化温度. [FePt(4 nm)/Cu(0.2 nm)]10多层膜在350 ℃热处理1 h后, 有序度增至0.6, 矫顽力达到421 kA/m. 对插入极薄Cu层促进有序化在较低的温度 下进行的热力学和动力学因素进行了讨论.
FePt/Cu multilayers and FePt thin films were prepared by DC magnetron sputtering. The as-prepared samples were annealed in vacuum at a temperature range of 300-550 ℃ for 1 h. It is found that the addition of Cu could reduce the ordering temperature of FePt. The ordering parameter $S$ was evaluated to be 0.6, and the coercivity reached 421 kA/m in [FePt(4 nm)/Cu(0.2 nm)]10 multilayers annealed at 350 ℃. The Cu layer induced reduction of ordering temperature is ascribed to both kinetic and thermodynamic factors.
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