微晶玻璃是一种新型的硬盘基板材料,目前大多采用超精密研磨和抛光进行加工.本文针对微晶玻璃低温抛光加工过程,研究了低温条件下微晶玻璃的脆塑转变机理,采用维氏硬度计研究了微晶玻璃在不同温度下的硬度以及裂纹的产生、扩展及特征,分析了温度对微晶玻璃脆塑转变的影响.结果表明:不同温度下,随着载荷的增加,微晶玻璃都经历了从塑性变形到脆性断裂的转变过程;随着温度的降低,微晶玻璃的显微硬度逐渐增加而裂纹长度减小.
Glass-ceramic is a new kind of substrate for hard disk of computer. In recent years, the mostly used ultra-precision machining methods are lapping and polishing. In this paper, the mechanism of brittle-ductile transition of glass-ceramics at different low temperatures was studied. Formation, propagation,length of crack and hardness of glass-ceramics were investigated at different temperature by means of Vickers indentation. The effect of temperature on the mechanism of its brittle-ductile transition was analyzed. Results show that with the increase of load at different temperatures, glass-ceramic goes through the ductile to brittle transition. Besides, with the decrease of temperature its hardness increases gradually,and the length of crack decreases.
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