将稀土相CeSn3、LaSn3、(La0.4Ce0.6)Sn3及ErSn3暴露于空气中,研究在时效处理过程中其表面Sn晶须的生长规律.结果表明:室温时效过程中,在稀土相的表面均出现了Sn晶须的生长现象,且稀土相LaSn3的表面倾向于形成包状和扭结状的Sn晶须,稀土相CeSn3和(La0.4Ce0.6)Sn3的表面倾向于形成针状和扭结状的Sn晶须,而稀土相ErSn3的表面倾向于形成大尺寸的杆状和棒状Sn晶须.150℃时效过程中,稀土相CeSn3、LaSn3和(La0.4Ce0.6)Sn3的表面没有出现Sn晶须的生长现象,而稀土相ErSn3的表面出现了大量的小尺寸线状Sn晶须.综上所述,稀土相的氧化倾向决定了其表面Sn晶须的生长规律.
参考文献
| [1] | Tu K N;Chen C;Wu A T .[J].Journal of Materials Science:Materials in Electronics,2007,18:269. |
| [2] | Boettinger W J;Johnson C E;Bendersky L A et al.[J].Acta Materialia,2005,53:5033. |
| [3] | Sheng G T T;Hu C F;Choi W J et al.[J].Journal of Applied Physics,2002,92:64. |
| [4] | Zeng K.;Tu KN. .Six cases of reliability study of Pb-free solder joints in electronic packaging technology [Review][J].Materials Science & Engineering, R. Reports: A Review Journal,2002(2):55-105. |
| [5] | Mason M S;Eng G .[J].J Vac Sci TechnolA,2007,25:1562. |
| [6] | Ellis W C;Gibbons D F;Treuting R C.Growth of Metal Whiskers From the Solid,Growth and Perfection of Crystals[M].New York:John Wiley and Sons,Inc,1958:102. |
| [7] | Fisher R M;Darken L S;Carroll K G .[J].Acta Metallurgica,1954,2(03):368. |
| [8] | Lin Y W;Lai Y S .[J].Journal of Electronic Materials,2007,37(01):17. |
| [9] | Hilty R.D.;Corman N.E.;Herrmann H. .Electrostatic fields and current-flow impact on whisker growth[J].IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,2005(1):75-84. |
| [10] | Fukuda Y;Osterman M;Pecht M .[J].Microelectronics Reliability,2007,47:88. |
| [11] | Chen Z G;Shi Y W;Xia Z D .[J].Journal of Electronic Materials,2004,33(09):964. |
| [12] | Chen Z G;Shi Y W;Xia Z D et al.[J].Journal of Electronic Materials,2002,31(10):1122. |
| [13] | Yu D Q;Zhao J;Wang L .[J].Journal of Alloys and Compounds,2004,376:170. |
| [14] | 郝虎,田君,史耀武,雷永平,夏志东.SnAgCuY系稀土无铅钎料显微组织与性能研究[J].稀有金属材料与工程,2006(z1):121-123. |
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