采用原位聚合方法,以氯金酸(HAuCl4)为氧化剂,苯胺(ANI)为还原剂,在金和玻璃表面上制备出聚苯胺-金复合材料膜.用光学照片、扫描电镜(SEM)、红外光谱(FT-IR)、紫外光谱(UV-Vis)和四探针电导率测试仪对复合膜的形貌、化学结构和导电性能进行了表征.结果表明,复合材料在芯片上形成一层均匀的复合膜,且更容易沉积在金表面,复合膜中金粒子的平均粒径约400nm,较均匀地分散在膜的表面和内部.当氯金酸浓度小于30mmol/L时,复合膜的电导率随氯金酸浓度的升高而增大.
The polyaniline-gold(PANI-Au) composite films deposited on gold and glass surface are prepared using HAuCl4 as oxidant and aniline(ANI) as reduction agent by in-situ polymerization. The film morphology, chemical structure and conductivity of composite film are characterized by optical photograph, scanning electron microscopy (SEM), fourier transform infrared(FTIR), UV-Visible(UV-Vis) and four-probe testing meter. The experimental result shows that the composite film uniformly covers the gold and glass surface. Gold particles well disperses in the surface and inside of PANI film,with an average particle size of about 400nm. On the other hand, the composite film is more easily deposited on gold surface. When the concentration of HAuCl4 is less than 30mmol/L, the conductivity of composite film increased with the rise of HAuCl4.
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