欢迎登录材料期刊网

材料期刊网

高级检索

介绍了用于制备薄膜材料的磁控溅射技术,总结了以改变磁场分布方式而得到的各类新型磁控溅射方式,如非平衡磁场(扩散性、内敛性、闭合场),扫描磁场,强度可变磁场,在基片、靶面或其他部位外加的磁场,高强度磁场等.

参考文献

[1] 田民波.薄膜技术与薄膜材料[M].北京:清华大学出版社,2006
[2] 郑伟涛.薄膜材料与薄膜技术[M].北京:化学工业出版社,2004
[3] 寇生中,程艳玲,郭燕.磁控溅射法在生物材料表面制备羟基磷灰石涂层的研究现状[J].材料导报,2006(06):107-110.
[4] 杨武保.磁控溅射镀膜技术最新进展及发展趋势预测[J].石油机械,2005(06):73-76.
[5] 张继成,吴卫东,许华,唐晓红.磁控溅射技术新进展及应用[J].材料导报,2004(04):56-59.
[6] 徐万劲.磁控溅射技术进展及应用(上)[J].现代仪器,2005(05):1-5.
[7] Kelly P J;Arnell R D .Magnetron sputtering:a review of recent developments and applications[J].Vacuum,2000,56:159.
[8] P. J. Kelly;J. Hisek;Y. Zhou .Advanced coatings through pulsed magnetron sputtering[J].Surface Engineering,2004(3):157-162.
[9] 赵嘉学,童洪辉.磁控溅射原理的深入探讨[J].真空,2004(04):74-79.
[10] Mark J;Paul C .Modeling magnetrion sputter deposition[J].Materials and Manufacturing Processes,2006,21(06):628.
[11] Svadkovski L .Characteration parameters for unbalanced magnetron sputtering system[J].Vacuum,2003,68:283.
[12] Lee T H;Hwang F T et al.Investigation of LiNbO3 thin films grown on Si substrate using magnetron sputter[J].Materials Science and Engineering B:Solid State Materials for Advanced Technology,2007,136:92.
[13] 杨武保,范松华,张谷令,马培宁,张守忠,杜健.非平衡磁控溅射法类金刚石薄膜的制备及分析[J].物理学报,2005(10):4944-4948.
[14] Brien J;Arnell R D .Production and characterization of chemically reactive porous coatings of zirconium via unbalanced magnetron sputtering[J].Surface and Coatings Technology,1996,86(03):206.
[15] Fox V;Hampshire J;Teer D G .MoS2/metal composite coatings deposited by closed-field unbalanced magnetron sputtering:Tribological properties and industrial uses[J].Surface and Coatings Technology,1999,112(1-3):118.
[16] 周晖,温庆平,郝宏,谭立,王长胜,薛德胜.非平衡磁控溅射沉积MoS2-Ti复合薄膜结构与磨擦摩损性能研究[J].摩擦学学报,2006(02):183-187.
[17] Yang S;Camino D et al.Deposition and tribological behavior of sputtered carbon hard coatings[J].Surface and Coatings Technology,2000,124(02):110.
[18] T. Seino;T. Sato .Aluminum oxide films deposited in low pressure conditions by reactive pulsed dc magnetron sputtering[J].Journal of Vacuum Science & Technology, A. Vacuum, Surfaces, and Films,2002(3):634-637.
[19] Lingwal V;Panwar N S .Scanning magnetron sputtered TiN coating as diffusion barrier for silicion devices[J].Journal of Applied Physics,2005,97(10):104902.
[20] West G T;Kelly P J .Improved mechanical properties of optieal coatings via an enhanced sputtering process[J].Thin Solid Films,2004,20:447.
[21] 赵新民,狄国庆,朱炎.外加磁场对磁控溅射靶利用率的影响[J].真空科学与技术学报,2003(02):104-106.
[22] Onishi Shinzo .Magnetron sputtering target for magnetic materials[P].US 662361081,2003-09-23.
[23] Chen Xiaohong;Fan Qihua;Chen Hongyou et al.Symmetrical magnet magnetron sputtering method for improving target utilization[J].Review of Scientific Instruments,1994,65(08):2693.
[24] 杨长胜,程海峰,唐耿平,李效东,楚增勇,周永江.磁控溅射铁磁性靶材的研究进展[J].真空科学与技术学报,2005(05):372-377.
[25] 常天海.高磁场强度的矩形平面磁控溅射靶的设计[J].真空与低温,2003(01):17-20.
[26] 徐万劲.磁控溅射技术进展及应用(下)[J].现代仪器,2005(06):5-10.
[27] Boo Jin-Hyo;Jung Min Jae;Park Heon Kyu et al.High-rate deposition of copper thin films using newly designed highpower magnetron sputtering source[J].Surface and Coatings Technology,2004,188-199:721.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%