采用无添加剂的铜盐–硫酸体系对电解铜箔进行多步粗化，一方面能保证铜箔具有较高的抗剥强度，另一方面能防止表面铜颗粒脱落。研究了电流密度、电解液铜含量、硫酸含量、温度等因素对粗化效果的影响。结果表明，电流密度是粗化的主要影响因素，通过调节电流密度可同时达到粗化和固化效果。最佳粗化工艺条件为：Cu2+30 g/L，H2SO4110~150 g/L，温度35°C，前3步粗化电流密度270 A/dm2，后8步粗化电流密度40 A/dm2，总时间17~30 s。采用该工艺处理电解铜箔，所得粗化层表面无铜粉脱落，粗糙度大于8.40μm，抗剥强度大于2.10 N/mm，满足厂家要求。
Electrolytic copper foil was treated by multistep roughening in an additive-free copper salt–sulfuric acid bath. The process not only guarantees high peel strength of copper foil, but also prevents the falling off of copper particles on the foil surface. The effects of current density, copper ion content, sulfuric acid content in electrolyte, and temperature on the roughening efficiency were studied. The results showed that current density is the major factor affecting the roughening effectiveness. Copper foil can be roughened and solidified simultaneously by adjusting current density. The optimal roughening process conditions are as follows:Cu2+30 g/L, H2SO4 110-150 g/L, temperature 35 °C, current density 270 A/dm2 at preliminary three steps and 40 A/dm2 at the subsequent 8 steps, and total time 17-30 s. The roughened layer obtained by treating electrolytic copper foil under the optimal conditions features no falling off of copper particle, a roughness of 8.40μm or above, and a peel strength higher than 2.10 N/mm2, meeting the users’ requirements.
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