用双层辉光等离子渗金属技术,在C/C复合材料基体表面制备了铼涂层,研究了铼涂层显微结构、相组成、硬度以及结合强度.结果表明,铼涂层致密光滑,由多晶结构的柱状晶粒组成,晶粒尺寸在0.5◇1.5 μm之间.涂层(110)和(103)晶面发生了择优生长.涂层HV显微硬度为6.66±0.25 GPa.制备过程中涂层与基体发生互扩散,界面既有机械结合又有物理结合.划痕试验加载过程中,当C/C复合材料基体由于硬度和韧性低而发生破碎后,铼涂层与基体仍结合良好.
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