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通过对粉料特性、流延工艺、流延带质量、排胶、烧结以及成瓷显微结构的研究,制得了结构均匀无裂纹的生料带,获得了热导率为248 W/mK的高性能氮化铝陶瓷基板.

参考文献

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[2] Nobuyuki Kuramoto;Hitofumi Taniguchi;Isao Aso .[J].IEEE Transactions on Components Packaging and Manufacturing Technology,1986,9(04):386.
[3] Kurokawa Y;Uteumi K;Takamizawa H et al.[J].IEEE Transactions on Components Packaging and Manufacturing Technology,1985,8(02):247.
[4] Werdecker W;AidingerF .[J].IEEE Transactions on Comp Hybrids Manuf Technot,1984,7(04):399.
[5] Borom M P;Slack G A;J Szymaszek W .[J].American Ceramic Society Bulletin,1972,52(11):852.
[6] Komeya K;Tsuge A;Inoue H et al.[J].Journal of Materials Science Letters,1982,34(01):325.
[7] Baranda P S;Knudsen A K;Ruh E .[J].Journal of the American Ceramic Society,1993,76(07):1761.
[8] Baranda P S;Knudsen A K;Ruh E .[J].Journal of the American Ceramic Society,1994,77(07):1846.
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