研究了电流脉冲对淬火45碳钢试样位错密度和表面残余应力的影响.根据XRD图谱,采用Modified Williamson-Hall(MWH)方法计算位错密度,进一步结合微观组织结构,分析了位错密度和残余应力的关系.结果表明,电流脉冲处理前后,位错密度由1.21 ×1015m-2变为0.80×1015m-2,表面残余应力σx由-250 MPa降低到-142 MPa,σy由-363 MPa降低到-172 MPa.与热处理相比,电流脉冲处理的试样位错密度和残余应力的降低率都比较大,表明电流脉冲除了产生热作用外,还产生了非热作用.位错密度和残余应力存在一定关系,符合Kocks-Mecking模型.电流脉冲处理过程中,位错激活运动,导致位错湮灭,位错密度降低,是残余应力降低的主要因素.
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