欢迎登录材料期刊网

材料期刊网

高级检索

聚酰亚胺薄膜因表面光滑和亲水性差,导致其粘接性能低,有必要对其进行表面改性.从聚酰亚胺薄膜表面性质出发,详细介绍了酸碱处理、等离子处理、离子束和表面接枝等几种不同的聚酰亚胺薄膜表面改性方法及其研究进展.通过这些改性方法,聚酰亚胺薄膜表面与其他材料的粘接性能得到显著提高.

参考文献

[1] 张雯,张露,李家利,张凯.国外聚酰亚胺薄膜概况及其应用进展[J].绝缘材料,2001(02):21-23.
[2] Soo-Jin Park;Eun-Jung Lee;Soo-Han Kwon .Influence of Surface Treatment of Polyimide Film on Adhesion Enhancement between Polyimide and Metal Films[J].Bulletin of the Korean Chemical Society,2007(2):188-192.
[3] 辜信实.印制电路用覆铜箔层压板[M].北京:化学工业出版社,2002:389.
[4] Xu Dong Huang;Sunil Madhukar Bhangale;Peter M Moran;Nikolai L Yakovlev;Jisheng Pan .Surface modification studies of Kapton HN polyimide films[J].Polymer international,2003(7):1064-1069.
[5] Yun HK.;Kim JK.;Park CE.;Sim SM.;Oh SY.;Park JM.;Cho K. .ADHESION IMPROVEMENT OF EPOXY RESIN/POLYIMIDE JOINTS BY AMINE TREATMENT OF POLYIMIDE SURFACE[J].Polymer: The International Journal for the Science and Technology of Polymers,1997(4):827-834.
[6] Lee K W;Kowalczyk S P;Shaw J M .Surface modification of BPDA-PDA polyimide[J].Langmuir,1991,7(11):2450.
[7] Zhu B;Iwata H;Hirata I et al.Hydrophilic modifcation of a polyimide film surface[J].Journal of Adhesion Science and Technology,2000,14(03):351.
[8] Factor B J;Russell T P;Toney M F .Grazing incidence Xray scattering studies of thin films of an aromatic polyimide[J].Macromolecules,1993,26(11):2847.
[9] Zuo M.;Matsumoto A.;Tsutsumi K.;Takeichi T. .Surface characterization of polyimide films[J].Colloid and polymer science,1998(7):555-564.
[10] PAT HOONTRAKUL;R.A.PEARSON .Surface reactivity of polyimide and its effect on adhesion to epoxy[J].Journal of Adhesion Science and Technology: The International Journal of Theoredtical and Basic Aspects of Adhesion Science and Its Applications in All Areas of Technology,2006(16):1905-1928.
[11] Saraf R F;Roldan J M;Derderian T .Tailoring the surface morphology of polyimide for-improved adhesion[J].IBM Journal of Research and Development,1994,38:441.
[12] Thomas R R;Buchwalter S L;Buchwalter L P et al.Organic chemistry on a polyimide surface[J].Macromolecules,1992,25(18):4559.
[13] 唐培汉.聚酰亚胺薄膜的碱处理[J].绝缘材料,1982(05):44.
[14] Lee S;Park S S;Lee H K .Improvement of adhesion between copper layer and polyimide films modified with alkaline potassium permanganate and/or alkali surface treatments[J].Macromolecular Symposium,2007,249-250:586.
[15] 熊艳丽,王汝敏,王云芳,郑刚,逯敏飞.等离子体表面改性在高聚物中的应用进展[J].塑料,2005(03):19-23.
[16] 黄永刚,陈敏,李长敏,田继文.低温等离子体技术在生物材料表面改性中的应用[J].材料导报,2004(02):72-74.
[17] Bogaerts A;Neyts E;Gijbels R et al.Gas discharge plasmas and their applications[J].Spectrochim Acta Part B:Atom Spectroscopy,2002,57(04):609.
[18] 郭玉海,张建春,施楣梧.电晕放电处理对涤纶织物粘接性能的影响[J].化学与黏合,2000(01):25-26,37.
[19] Ogawa T;Baba S;Fujii Y .Improvement of bond strength of BPDA-PDA-type polyimide film by corona discharge treatment[J].Journal of Applied Polymer Science,2006(4):3403-3408.
[20] 金佑民;樊友三.低温等离子体物理基础[M].北京:清华大学出版社,1983:193.
[21] 阮久福,孟月东,舒兴胜.等离子体表面改性与大气压辉光放电的产生[J].印染,2006(09):39-42.
[22] Lin YS;Liu HM;Tsai CW .Nitrogen plasma modification on polyimide films for copper metallization on microelectronic flex substrates[J].Journal of Polymer Science, Part B. Polymer Physics,2005(15):2023-2038.
[23] Lin YS;Liu HM;Chen CL .Plasma surface modification of polyimide films by air glow discharge for copper metallization on microelectronic flex substrates[J].Surface & Coatings Technology,2006(12/13):3775-3785.
[24] 江南,陶晓峰,凌一鸣.无声放电等离子体的光谱诊断[J].真空科学与技术学报,2000(02):108-110.
[25] Park W J;Yoon S G;Jung W S .Effect of dielectric barrier discharge on surface modification characteristics of polyimide film[J].Surface and Coatings Technology,2007,201(9-11):5017.
[26] Kim SH;Cho SH;Lee NE;Kim HM;Nam YW;Kim YH .Adhesion properties of Cu/Cr films on polyimide substrate treated by dielectric barrier discharge plasma[J].Surface & Coatings Technology,2005(1/3):101-106.
[27] Inagaki N;Tasaka S;Hibi K .Surface modification of Kapton film by plasma treatments[J].J Polym Sci:Part A:Polymer Chem,1992,30(07):1425.
[28] 唐国翌,朱明,陈锡花,方健.聚合物材料的离子束表面改性及工程应用前景[J].清华大学学报(自然科学版),1999(10):1-3.
[29] Ruoff A L;Kramer E J;Li C Y .Improvement of adhesion of copper on polyimide by reactive ion-beam etching[J].IBM Journal of Research and Development,1988,32(05):626.
[30] Ektessabi AM.;Hakamata S. .XPS study of ion beam modified polyimide films[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2000(0):621-625.
[31] 李笃信,贾德民.等离子体技术对高分子材料的表面改性[J].高分子材料科学与工程,1999(03):172.
[32] Wang WC.;Kang ET.;Neoh KG. .Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2002(1/4):52-66.
[33] Chan-park M B;Tan S S .Thermal graft copolymerization of 4-vinyl pyridine on polyimide to improve adhesion to copper[J].International Journal of Adhesion and Adhesives,2002,22(06):471.
[34] 任煜,邱夷平.低温等离子体对高聚物材料表面改性处理时效性的研究进展[J].材料导报,2007(01):56-59.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%