以硅粉(Si)为起始原料,糊精为粘结剂,采用三维打印(3DP)快速成型技术制备出多孔硅坯体,通过反应烧结得到高孔隙率的氮化硅(Si3N4)陶瓷.研究了反应烧结工艺对3DP多孔Si3N4陶瓷性能的影响.结果表明:3DP成型的硅坯体采用阶梯式升温机制,可得到抗弯强度为(5.1±0.3)MPa,孔隙率达(74.3±0.6)％的多孔Si3 N4陶瓷.反应烧结后,样品的线收缩率小于2.O％.三维打印结合反应烧结法实现了复杂形状陶瓷构件的无模制造与净尺寸成型.
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