电子封装SiCp/Al复合材料导热性能研究与进展

金属功能材料, 2009, 16(1): 59-64.

电子封装SiCp/Al复合材料导热性能研究与进展

余志华 ^1, , 张建云 ^2, , 周贤良 ^3, , 邹爱华 ^4,

1.南昌航空大学材料科学与工程学院,江西,南昌,330063

2.南昌航空大学材料科学与工程学院,江西,南昌,330063

3.南昌航空大学材料科学与工程学院,江西,南昌,330063

4.南昌航空大学材料科学与工程学院,江西,南昌,330063

基金项目: 江西省自然科学基金(2007GzCl634) 江西省教育厅科研项目(GJJ08023)

关键词：电子封装 , SiCp/Al复合材料 , 热导率

Research and Development on Thermal Conductivity of SiC/AI Composites Applied to Electronic Packaging

概述了电子封装用SiCp/Al复合材料导热性能研究的现状与进展,分析了基体成分、增强体SiCp颗粒体积分数、增强体SiCp颗粒尺寸及形貌、热处理工艺以及复合材料中界面对SiCp/Al复合材料导热性能的影响,并介绍了复合材料热导率的理论计算模型与测试方法.

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电子封装SiCp/Al复合材料导热性能研究与进展

Research and Development on Thermal Conductivity of SiC/AI Composites Applied to Electronic Packaging

参考文献