在含Na2SiO310 g/L、NaOH 2 g/L、Na2WO4 2 g/L、Na2EDTA 2 g/L和C3H8O3 10 mL/L的电解液和正/负向电压取440/130 V的条件下对铝合金(ZL108)进行微弧氧化处理.利用涡流测厚仪、XRD、光学显微镜和SEM对获得膜层进行表征.通过观察微正向电流变化分析膜层的形成过程.研究发现,在电压达到预设值前,试样表面只形成了局部的氧化膜,对电流的影响不显著.氧化2 min到12 min之间,膜层快速增长,最大值达8.75 μm/min,膜层仅含γ-Al2O3相,膜层表面氧化物颗粒数目及尺寸均增加.膜层向内外同时生长.但膜层较为疏松易被溶解,由于膜层沉积-溶解交替进行引起电流在8A和6A之间波动.氧化12 min到35 min之间,膜层缓慢增长,最小值达0.5μm/min,膜层以向内生长为主.膜层中3Al2O3·2SiO2和γ-Al2O3相的含量有减少的趋势,而d-Al2O3相和SiO2相在增加.氧化膜经过高温相变与烧结生成致密的陶瓷膜.陶瓷颗粒由椭球形转变成圆球形.膜层增厚变密导致电流由6A持续下降到2A.氧化到53 min时,立刻息弧,膜层停止生长.微弧氧化正向电流的变化间接地反映了氧化膜的形成.
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