研究了多孔硅层孔隙率对其热绝缘性能的影响机制.以P+型硅片为基底,通过双槽电化学腐蚀法制备多孔硅.采用微拉曼光谱法对多孔硅的热导系数进行了测量,结果表明,多孔硅的热导系数随其孔隙率的增大而明显下降,实验中热导系数最低可达到0.624W/(m·K),从而通过降低热导系数使多孔硅的绝热性能得到了增强.
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