以双酚A环氧树脂E51和DER331混合物为主体树脂，使用酸酐类固化剂，配合稀释剂及环氧增韧剂， DMP-30为固化促进剂，活性硅微粉等为填料，制备了高性能电子环氧灌封胶，并分析了各组分对环氧灌封胶性能的影响。结果表明：经过优化配方后的环氧灌封胶力学性能好，介电性能优异，与国外同类灌封胶比较，各项性能均优于国外产品，适用于大功率电子元件的灌封。
Using the mixture of bisphenol A epoxy resin E51 and DER331 as main resin, acid anhydride as curing agent, self-made toughening agent as additive,DMP-30 as curing accelerator, active silica powder as filler, a high performance electronic epoxy pouring sealant was prepared, and the effects of different components on the properties of the epoxy pouring sealant were analyzed. The results show that the epoxy pouring sealant has good mechanical and dielectric properties after optimizing formula, and their properties are superior to that of foreign similar product, which is suitable for embedment of high power electronic component.
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