Ta/NiFe/Bi (Ag,Cu)/FeMn/Ta and Ta/NiFeⅠ/FeMn/Bi (Ag, Cu)/NiFeⅡ/Ta films were prepared by magnetic sputtering. The texture and the dependences of the exchange-coupling field on the thickness of Bi, Ag, and Cu in Ta/NiFe/Bi(Ag, Cu) /FeMn/Ta and Ta/NiFeⅠ/FeMn/Bi(Ag, Cu)/NiFeⅡ/Ta films were studied. XPS results indicate that the Bi atoms migrated into the FeMn layer during the deposition process and a FeMnBi alloy was probably formed or the Bi atoms existed as an impurity in the FeMn layer in Ta/NiFe/Bi(Ag, Cu)/FeMn/Ta. Otherwise, in Ta/NiFeⅠ/FeMn/Bi (Ag, Cu ) /NiFeⅡ/Ta films, Bi, Ag, and Cu atoms do not remain entirely at the interface of the FeMn/NiFeⅡ film, but at least partly segregate to the surface of the NiFe film.
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