采用一种新方法制备Sn-2.8Ag0.5CuX亚共晶改性钎料,研究液态钎料的工艺性能.发现原子掺杂能显著改善液态钎料的抗氧化性、润湿性和漫流性,而亚共晶的成分设计既能降低钎料成本,又能延长液态钎料在使用过程中的稳定性.在265℃和大气气氛下,液态钎料表面氧化渣的生成速率仅为0.36 mg/cm~2·min;当采用RMA-flux钎剂时,t_0=0.82s,F_3=0.75 mN,扩展率接近78%.
Sn-2.8Ag0.5CuX modified hypoeutectic solder was prepared by a new method. The processing properties of the liquid solder were studied. The results show that atomic-doping can significantly improve the oxidation resistance, wettability and overflowing ability of melting solder. The hypoeutectic component can reduce the solder cost and extend the stability of the liquid solder in the using process.In the air atmosphere at 265℃,the formation rate of oxide slag on liquid solder surface is only 0.36mg/cm~2·min.When using RMA-flux, the wetting time t_0 is 0.82 s, wetting force F_3 is 0.75 mN, and the rate of spread is about 78% for the solder on copper.
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