采用微生物技术、表面分析技术以及电化学测量技术, 研究了从再生水环境中分离提纯得到的硫酸盐还原菌(SRB) 的形态、生长规律, 以及SRB对铜合金HSn701-AB在再生水环境中腐蚀的影响. 结果表明, 在再生水环境中SRB的生长曲线存在2 d~3 d的停滞期; 铜合金HSn701-AB在接种SRB 的再生水环境中浸泡3 d时, 出现阻挡层扩散阻抗, 随着浸泡时间的增长, 腐蚀加重, 20 d时其表面生成致密的SRB生物膜.
The morphology and growth characters of sulfate reducing bacteria, which were separated from recycled water, and its effect on corrosion of copper alloy HSn701-AB in recycled water were investigated by means of microbiological technology, surface analysis technique and electrochemical impedance spectroscopy. The results showed that the growth of SRB had 2 d~3 d's lag phase in recycled water. After immersed in recycled water with SRB for 3 days, the copper alloy HSn701-AB showed features of barrier diffusion impedance, and with the immersion time increased, the corrosion of HSn701-AB became severe in company with formation of a dense SRB bio-film.
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