欢迎登录材料期刊网

材料期刊网

高级检索

将颗粒尺寸分布较宽的钛酸钡(BT)粉末与环氧树脂采用溶液共混旋涂工艺制备了嵌入式电容器材料,并对该复合材料的显微结构、晶相、热稳定性及介电性能进行了分析.研究表明,该复合材料的介电常数及介电损耗与陶瓷相含量和陶瓷粉末的分散有关;在20~150kHz频率范围内,复合材料介电常数的变化较为稳定,而介电损耗值均在0.036~0.039之间,随频率增大略有增大;受BT粒子的影响,复合材料基体聚合物的有序排列分子结构被破坏,环氧树脂分子链的排列密度降低;BT粉末的加入及BT含量的增加均导致材料体系的固化温度和热分解温度提高.

参考文献

[1] Rao Y;Ogitani S;Kohl P et al.[J].Journal of Applied Polymer Science,2002,83(06):1084-1090.
[2] S. K. Bhattacharya;R. R. Tummala 20f .Integral passives for next generation of electronic packaging: application of epoxy/ceramic nanocomposites as integral capacitors[J].Microelectronics journal,2001(1):11-19.
[3] Atsushi Nishino .[J].Power Sources,1996,60(26):137-147.
[4] Fan L;Kunmashiro Y;Wong C P .[J].IEEE Electronic Components & Technology Conference,2003,21(01):247-256.
[5] Hiramatsu H;Tamura T;Wada N et al.[J].Materials Science and Engineering B:Solid-State Materials for Advanced Technology,2005,120(1-3):55-58.
[6] Arlt G;Henning D .[J].Journal of Applied Physics,1985,58(04):1619-1625.
[7] Waser R .[J].Integrated Ferroelectrics,1997,15:39-51.
[8] Uchino K;Sadanaga E;Hirose T D .[J].Journal of the American Chemical Society,1989,72(08):1555-1558.
[9] Chahal P;Tummala R T;Allen M G et al.[J].IEEE Electronic Components & Technology Conference,1996,4(01):125-132.
[10] Ramesh S;Shutzberg B A;Huang C et al.[J].IEEE Trans Adv Packing,2003,26(01):17-24.
[11] Sinha Dolly;Pillai P K C .[J].Mater Science Letter,1989,8(03):673-674.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%