本文采用直流四电极法研究了Sn-3.5Ag-3.5Bi焊料熔体在连续两轮的升降温过程中电阻率随温度的变化关系,以此为基础进一步研究了该合金在650℃和800℃保温7h及随后的升温过程中电阻率的变化规律.结果表明,Sn-3.5Ag-3.5Bi合金中存在液-液结构转变,并且该结构转变在第一轮升温后是可逆的.结合保温及随后升温实验结果可知在第一轮升温过程中的结构转变是由不可逆和可逆两种不同类型的结构转变组成的.文章还从短程有序的角度分析了引起这两种转变的机制.
参考文献
[1] | JEFF CANNIS .Green IC packaging[J].Advanced packaging,2001(8):33-34,36,38-0. |
[2] | 2 nd EU lead-free soldering technology roadmap and framework for an international lead-free soldering roadmap[M].Soldertec at Tin Technology,2003:2. |
[3] | Mansalve E R.Lead ingestion hazard in hand soldering environments[A].Naval Weapons Center,China Lake,CA,1984:16-27. |
[4] | Wood E P;Nimmo KL .In search of new lead-free electronic solders[J].Journal of Electronic Materials,1994,23(08):709-713. |
[5] | K. S. Kim;S. H. Huh;K. Suganuma .Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2003(1/2):226-236. |
[6] | C.M.L. Wu;D.Q. Yu;C.M.T. Law;L. Wang .Properties of lead-free solder alloys with rare earth element additions[J].Materials Science & Engineering, R. Reports: A Review Journal,2004(1):1-44. |
[7] | Xianfen Li;Fangqiu Zu;Lanjun Liu .Effect of Sn on reversibility of liquid-liquid transition in Bi-Sb-Sn alloys[J].Journal of Alloys and Compounds,2008(1/2):508-512. |
[8] | 陈红圣,祖方遒,陈杰,邹丽,丁国华,黄中月.熔体过热对Sn-Bi40合金熔体结构转变及凝固组织的影响[J].中国科学E辑,2009(01):141-145. |
[9] | 胡成明,李先芬,祖方遒,毛丽娜,刘明全,刘永驰.Sn-Bi合金熔体可逆液-液结构转变的研究[J].原子与分子物理学报,2008(04):1003-1007. |
[10] | 秦敬玉,边秀房,王伟民,S.I.Sliusarenko.Al和Sn液态结构的温度变化特性[J].物理学报,1998(03):438-444. |
[11] | Itami T;Munejiri S;Masaki T et al.Structure of liquid Sn over a wide temperature range from neutron scattering experiments and first2principles molecular dynamics simulation:a comparison to liquid Pb[J].Physical Review B,2003,67:064201-064212. |
[12] | 关绍康;沈宁福;胡汉起 .熔体热经历对快凝率铁基合金相形成的影响机制[J].铸造,1997,11:20-23. |
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