Application of Vacuum Drying to Silica Sol Ceramic Mold

材料科学技术（英文）, 2008, 24(2): 233-235.

^1, , ^2, , ^3, , ^4,

1.School of Materials Science and Engineering, Sichuan University, Chengdu 610065, China;School of Materials Science and Engineering, Xihua University, Chengdu 610039, China

2.School of Materials Science and Engineering, Shaanxi University of Technology, Hanzhong 723003, China;School of Materials Science and Engineering, Xihua University, Chengdu 610039, China

3.School of Materials Science and Engineering, Sichuan University, Chengdu 610065, China

4.Department of English, Xichang College, Xichang 615022, China

基金项目: Sichuan Key Laboratory of Special Materials and Processing Techniques,China

Application of Vacuum Drying to Silica Sol Ceramic Mold

Ming ZENG ^1, , Xinqiang YUAN ^2, , Baoluo SHEN ^3, , Yunqiu ZHENG ^4,

1.School of Materials Science and Engineering, Sichuan University, Chengdu 610065, China;School of Materials Science and Engineering, Xihua University, Chengdu 610039, China

2.School of Materials Science and Engineering, Shaanxi University of Technology, Hanzhong 723003, China;School of Materials Science and Engineering, Xihua University, Chengdu 610039, China

3.School of Materials Science and Engineering, Sichuan University, Chengdu 610065, China

4.Department of English, Xichang College, Xichang 615022, China

Keywords： Silica sol

Silica sol ceramic mold was made at room temperature with JN-30 silica sol, silica powder and NH4Cl. It is found that the harden time of silica sol ceramic mold is only 0.5 to 1.5 h under the amount of NH4CI solution of 7% to 8% with 15% concentration, and less surface cracks occur by using vacuum drying. The proper vacuum drying process parameters: vacuum drying temperature is 80 to 100℃, drying time is 5 h and vacuum is 0.06 to 0.07 MPa. The harden mechanics, vacuum drying mechanics and the reason of less surface cracks of silica sol ceramic mold by vacuum drying were also analyzed in this paper.

参考文献

[1]	P Muriel .[J].Fonderie Fondeur d' Aujourd' hui,2004,233:10.
[2]	M S Tsai;W C Wu .[J].Materials Letters,2004,58:1881.
[3]	K Esumi;Y Nakaie;K Sakal;K Torigoe .[J].Colloids and Surfaces A:Physicochemical and Engineering Aspects,2001,194:7.
[4]	C T Wang;C L Wu .[J].Thin Solid Films,2006,496:658.
[5]	D Y Kong;H Yang;S Wei;D Y Li and J B Wang .[J].Ceram Int,2007,33:133.
[6]	Z Adamczyk;B Jachimska;M Kolasinska .[J].Journal of Colloid and Interface Science,2004,273:668.

上一张下一张

上一张下一张

计量

下载量()
访问量()

作者相关

在本站搜索
在百度学术搜索
在万方数据库搜索
在CNKI搜索

文章评分

您的评分：
1

0%
2

0%
3

0%
4

0%
5

0%