为改善高导热铝基覆铜板剥离强度、击穿电压稳定性和绝缘可靠性，通过二次涂覆法在铜箔表面涂覆不同导热填料含量的复合粘结剂，制得一种高导热铝基覆铜板，并与一次涂覆法制备的高导热铝基覆铜板进行性能对比分析。结果表明：两种涂覆方法制备的高导热铝基覆铜板的绝缘层中填料分散均匀，其导热系数和热阻差异较小，都能通过288℃极限(带铜)浸锡和PCT测试；采用二次涂覆法制备的高导热铝基覆铜板的剥离强度和耐电压值均比一次涂覆法的有较大的提高。
To improve the peel strength, breakdown voltage, and insulating reliability of high thermal con-ductive aluminum based copper clad laminate(CCL), we prepared a high thermal conductive aluminum based CCL by coating the varnish with different content of thermal conductive filler on the copper foil surface twice, and its property was compared with the property of the aluminum based CCL prepared by once coating method. The results show that the filler can both well disperse in the insulation layer of the high thermal conductive aluminum based CCL prepared by the two methods, their thermal conductivi-ty and thermal resistance have little difference, and both of them can pass solderability test(with copper) and pressure cooker test(PCT). The high thermal conductivity aluminum base CCL prepared by twice coat-ing method has higher peel strength and breakdown voltage than that of the aluminum base CCL pre-pared by once coating method.
参考文献
| [1] | 蔡新民. 一种高频铝基电路板的制作方法:中国,102159029A [P]. 2011-08-17.,2011. |
| [2] | 张翔宇,程小霞.纳米氮化铝增强聚酰亚胺基高导热覆铜板的研究[J].绝缘材料,2013(04):18-20. |
| [3] | 周文英,齐暑华,吴轲,王彩凤,寇静利.高导热型铝基覆铜板研究[J].材料科学与工艺,2009(03):360-363. |
| [4] | Lee E S, Lee S M, Shanefield D J, et al . Enhanced Ther-mal Conductivity of Polymer Matrix Composite via HighSolids Loading of Aluminum Nitride in Epoxy Resin[J].Journal of the American Ceramic Society,2008,91(4):1169-1174.,2008. |
| [5] | 孔凡旺,苏民社,杨中强. 金属基板用高导热胶膜的研究[J]. 覆铜板资讯,2010(5):12-16.,2010. |
| [6] | 邓华阳,黄增彪,张华,等. 一种无卤高导热铝基板的研制[C]//第十三届中国覆铜板技术·市场研讨会论文集,上海,2012:106-109.,2012. |
| [7] | 孔凡旺,苏民社,杨中强.金属基板用高导热胶膜的研制[J].绝缘材料,2011(02):17-20. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%