有序碳基介孔材料具有比表面积大、导电和导热性高、化学稳定性好等特点,因而受到人们的密切关注.基于最新研究进展,总结了有序碳基介孔材料的硬模板法、软模板法合成路线及功能化方式,评述了各种方法的特点及局限性,并介绍了该类材料在吸附分离、催化、生物传感器以及能量存储等方面的应用研究进展.
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