利用低频电磁铸造(LFEC)-热反挤压方法制备了n-SiC/1350复合材料挤压材.通过金相组织观察(OM)、扫描电镜(SEM)、室温拉伸性能以及硬度、导电率等测试手段,研究了该复合材料热反挤压前后的显微组织、拉伸性能以及硬度、导电率的变化情况.结果表明:低频电磁铸造(LFEC)铸锭表面质量显著优于传统直冷半连续铸造(DC)铸锭表面;LFEC制备n-SiCp/1350复合材料铸锭组织中n-SiCp较DC铸锭组织显著均匀弥散,n-SiCp在凝固过程中发生团聚,尺寸为1.0～3.5 μm;LFEC制备复合材料铸锭晶粒较DC制备铸锭晶粒细小;拉伸试验结果表明,热挤压变形后LFEC制备复合材料的抗拉强度140.5 MPa、延伸率24.7％均优于DC铸锭挤压材的抗拉强度132.5MPa、延伸率20％;热挤压后,LFEC制备复合材料的硬度32HV略高于DC铸锭挤压材硬度30HV,导电率54.3％IACS略低于后者的54.6％IACS.
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