铜/镍纳米多层膜脉冲电沉积法制备及沉积机理初探

材料保护, 2009, 42(6): 20-35.

铜/镍纳米多层膜脉冲电沉积法制备及沉积机理初探

朱福良 ^1, , 于倩倩 ^2, , 黄达 ^3, , 谢建平 ^4,

1.兰州理工大学甘肃省有色金属新材料省部共建国家重点实验室,甘肃,兰州,730050

2.兰州理工大学材料科学与工程学院,甘肃,兰州,730050

3.兰州理工大学材料科学与工程学院,甘肃,兰州,730050

4.兰州理工大学材料科学与工程学院,甘肃,兰州,730050

基金项目: 甘肃省自然科学基金(3ZS042-B25-029) 兰州理工大学科研发展基金(0851)

关键词：电沉积机理 , 脉冲 , 铜/镍纳米多层膜 , 制备

Preparation of Pulse Electrodeposited Copper and Nickel Nano Multilayer and Primary Exploration of Its Deposition Mechanism

利用脉冲电沉积法成功制备出了层状结构清晰的Cu/Ni纳米多层膜.采用线性扫描伏安法、循环伏安法以及铜镍沉积过程中的电压-电流曲线等方法,研究了在硼酸系溶液中铜/镍纳米多层膜的沉积机理,使用扫描电子显微技术观察了多层膜的微观结构.结果表明:铜的沉积为扩散控制步骤,镍的沉积分为2步进行,即中间经历Ni(OH)+的过渡状态;铜、镍的沉积电位分别为-0.5 V和-1.1 V.经计算和测量对比,本脉冲法制备的多层膜符合基础电沉积原理.

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铜/镍纳米多层膜脉冲电沉积法制备及沉积机理初探

Preparation of Pulse Electrodeposited Copper and Nickel Nano Multilayer and Primary Exploration of Its Deposition Mechanism

参考文献