Sweep potential deposition of Tm-Ni-Co alloy films in dimethylsulfoxide

稀有金属（英文版）, 2004, 23(2): 189-192.

^1, , ^2, , ^3, , ^4, , ^5,

1.Department of Chemistry, Jinan University, Guangzhou 510632,China

2.Department of Chemistry, Jinan University, Guangzhou 510632,China

3.Department of Chemistry, Jinan University, Guangzhou 510632,China

4.School of Chemistry and Chemical Engineering, Zhongshan University, Guangzhou 510275, China

5.School of Chemistry and Chemical Engineering, Zhongshan University, Guangzhou 510275, China

基金项目: 广东省自然科学基金(011215 and 36706)

Sweep potential deposition of Tm-Ni-Co alloy films in dimethylsulfoxide

Keywords： physical chemistry

The Tm-Ni-Co alloy films have been prepared by the sweep potential deposition technique. The surface appearance of Tm-Ni-Co alloy films was silver, smooth and adhesive. The surfaces of Tm-Ni-Co alloy films observed by scanning electron microscope (SEM) were uniform, adhesive and compact. The sizes of metallic grains were about 80-100 nm, 100-200 amorphous as proven by the X-ray diffraction (XRD).

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Sweep potential deposition of Tm-Ni-Co alloy films in dimethylsulfoxide

参考文献