材料期刊网

The wettability of Si-Al-O-N ceramic by ternary alloys of Sn-Ti and copper, nickel, silver, indium or aluminum was investigated by sessile drop method in vacuum at 800-1100 K. The results show that a small addition of Ni (1-3 at.%) or Cu (5-10 at.%) is beneficial to the wettability of the solder on the ceramic at 1000 K, but Ag or In has little effect, and Al is harmful. In discussion, it was suggested that it is important to the chemical wetting of metal on ceramic, i.e. an interaction between the third element and the active metal or the matrix metal, and a fresh liquid surface: as a result, three criteria of how to select the third element to improve wetting of an active solder on ceramics were also proposed.