采用瓦特镀镍液,研究了脉冲占空比、平均电流密度、温度对电沉积速率,镀层光亮度和镀层在w=3.5%的NaCl溶液中耐蚀性的影响.用扫描电镜研究了直流和脉冲镍镀层的表面形貌.结果表明:电沉积速率随脉冲占空比、平均电流密度及温度的增大而加快;镀层耐蚀性,光亮度随脉冲占空比增大而变差,随温度、平均电流密度的增大先变好后变差.较佳脉冲电镀条件为:平均电流密度0.75 A/dm~2,脉冲占空比5%,温度45～50 ℃,pH 2.5～3.0.X射线衍射分析结果表明,与直流镀镍相比,脉冲镍镀层在(111)晶面存在择优取向,镀层更致密,性能更好.
The effects of pulse duty cycle, average current density and temperature on electrodeposition speed, brightness and corrosion resistance in 3.5% (mass fraction) NaCl solution of nickel coating were studied with a Watts- type nickel electroplating bath. The surface morphology was characterized by scanning electron microscopy. The results showed that the electrodeposition speed was increased with increasing pulse duty cycle, average current density and temperature. The corrosion resistance and brightness were decreased with increasing pulse duty cycle, while they became better at first and worse thereafter with the increase of temperature and average current density. The optimal plating conditions are as follows: average current density 0.75 A/dm~2, pulse duty cycle 5%, temperature 45-50 ℃, pH 2.5-3.0. Compared with direct-current nickel plating, the pulse-plated nickel has preferential orientation with (111). X-ray diffraction analysis showed that the deposit of pulse nickel plating is more compact and has better performarice.
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