四羟丙基乙二胺-乙二胺四乙酸二钠体系快速化学镀铜

电镀与涂饰 , 2014, 33(19): 818-822.

四羟丙基乙二胺-乙二胺四乙酸二钠体系快速化学镀铜

曹权根 ^1, , 陈世荣 ^2, , 杨琼 ^3, , 汪浩 ^4, , 王恒义 ^5, , 谢金平 ^6, , 范小玲 ^7,

1.广东工业大学轻化学院,广东广州,510006

2.广东工业大学轻化学院,广东广州,510006

3.广东工业大学轻化学院,广东广州,510006

4.广东工业大学轻化学院,广东广州,510006

5.广东致卓精密金属科技有限公司,广东佛山,528247

6.广东致卓精密金属科技有限公司,广东佛山,528247

7.广东致卓精密金属科技有限公司,广东佛山,528247

关键词：化学镀铜 , 四羟丙基乙二胺 , 乙二胺四乙酸二钠 , 沉积速率 , 稳定性

Rapid electroless copper plating from N,N,N',N'-tetrakis(2-hydroxypropyl) ethylenediamine-disodium ethylenediamine tetraacetate system

Keywords： electroless copper plating , N,N,N',N'-tetrakis-(2-hydroxypropyl) ethylenediamine , disodium ethylenediamine tetraacetate , deposition rate , stability

采用四羟丙基乙二胺(THPED)-乙二胺四乙酸二钠(EDTA-2Na)配位体系在环氧树脂板表面进行快速化学镀铜.研究了配位剂、主盐、添加剂和工艺参数等对沉积速率和镀液稳定性的影响,得到快速化学镀镍的最佳镀液配方和工艺条件为:CuSO4·5H2O 12 g/L,THPED 10g/L,EDTA-2Na 5.8 g/L,37％甲醛14 mL/L,2,2'-联吡啶15 mg/L,K4Fe(CN)610 mg/L,2-巯基苯并噻唑(2-MBT)5 mg/L,pH 12.5～ 13.0,装载量3.0 dm2/L,温度40～45℃,时间20 min.在最佳工艺条件下,化学镀铜的沉积速率可达12.7 μm/h,镀层表面平整、致密、光亮,背光级数达9级.

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