以NiO、Fe_2O_3和Cu、Fe、Ni为主要原料,采用两步固相烧结法,制备出Cu-NiFe_2O_4和Cu-Ni-Fe-NiFe_2O_4金属陶瓷试样.用阿基米德排水法测试样密度,并结合XRD和SEM分析其微观结构,测量了试样的静态热腐蚀率、抗热震性和电导率.研究表明,与Cu-NiFe_2O_4金属陶瓷比较,金属Fe、Ni的加入能够起到晶粒细化、提高致密度的作用,同时使Cu与陶瓷的润湿性得到改善.Cu-Ni-Fe-NiFe_2O_4试样在冰晶石熔盐中的静态热腐蚀率有所降低,而抗热震性有较大提高.电导率也有一定提高,原因是由于金属相均匀的分散于陶瓷相中,减小了晶界间的势垒作用,从而使载流子更易通过晶界.
Cu-NiFe_2O_4 and Cu-Ni-Fe-NiFe_2O_4 cermet samples were prepared by the solid-state sintering method with NiO, Fe_2O_3 and Cu, Fe, Ni, as the main material. The density of samples was tested by Archimedes draining method, and their microstructure were analyzed with XRD and SEM. The electrical conductivity, static thermal corrosion rate and thermal shock resistance were measured. The results show that the grain size decreased and the density and the wettability between metallic Cu and ceramics were improved by adding metallic Fe and Ni compared with the Cu-NiFe_2O_4 cermet samples. The static thermal corrosion rate of the Cu-Ni-Fe-NiFe_2O_4 samples in cryolite molten salt decreased and the thermal shock resistance increased. The reason of electrical conductivity increasing is the well dispersing of metallic phase in ceramic phase symmetrically. It is the carriers traverse the grain boundary due to the weakening of potential barriers effect existing in gain boundary.
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