用悬臂梁法研究了不锈钢4Cr13基体上的Cu膜和Ag膜的平均残余应力和残余应力分布.结果表明,Cu膜和Ag膜的平均残余应力和分布残余应力随膜厚的增加而急剧减小.2种膜生长过程中界面应力很大,而生长应力很小.Cu膜在厚度较小时,残余应力值很大,超过了铜块材的断裂强度.
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