Investigation on Aging-induced Softening of Eutectic Microstructure in SnBi/Cu Interconnect by Nanoindentation

材料科学技术（英文）, 2006, 22(1): 130-134.

^1, , ^2, , ^3, , ^4,

1.Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China;Department of Materials Engineering, Shenyang Institute of Aeronautical Engineering, Shenyang 110034, China

2.Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China

3.Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA

4.Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China;Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA

基金项目: The National Basic Research Program of China(2004CB619306) 中国科学院资助项目(50228101)

Investigation on Aging-induced Softening of Eutectic Microstructure in SnBi/Cu Interconnect by Nanoindentation

Keywords： Solder

Nanoindentation was used to probe softening of the eutectic microstructure in a SnBi/Cu interconnect following thermal aging. Tests were conducted at constant loading rates and under constant loads to characterize the flow stress and creep behavior of the eutectic microstructure. Aging was found to reduce the flow stress but to increase strain-rate sensitivity of the eutectic SnBi microstructure. While the reduction in the flow stress was related to the coarsening of the eutectic microstructure, the increased creep rate sensitivity was resulted from additional contribution of grain boundary movement to indentation creep.

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Investigation on Aging-induced Softening of Eutectic Microstructure in SnBi/Cu Interconnect by Nanoindentation

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