以乳液聚合法制备粒径分布均匀、球形度良好的聚硅氧烷微球。采用扫描电镜（SEM）、动态光散射（DLS）、红外光谱（FT-IR）、X射线衍射（XRD）、热重分析（TGA）和接触角等测试技术对微球的微观形貌、粒径大小及分布、聚集态结构、耐热性、疏水性等进行了表征。将平均粒径为1.5μm的聚硅氧烷微球作为光散射剂添加到光学级聚甲基丙烯酸甲酯（PMMA）树脂中,可制备出性能优良的光散射材料。当聚硅氧烷微球添加质量分数约0.6%时,光散射材料的透光率是86.1%,雾度是91.25%,拉伸强度达到最大值77.2 MPa,弯曲强度是87.2 MPa,简支梁缺口冲击强度是2.16 kJ/m2,悬臂梁缺口冲击强度是2.71 kJ/m2,综合性能良好。
Highly uniform and monodisperse polysiloxane microspheres were prepared by emulsion polymeration.The morphology,size distribution,and state of aggregation were characterized by SEM,dynamic light scattering（DLS）,FT-IR and XRD.The thermodecomposition and hydrophobicity of these microspheres were investigated with TGA and water contact angle measurement.Light scattering material with excellent performance could be prepared by blending polysiloxane microspheres（the average size of 1.5 μm） with optical-grade polymethylmethacylate（PMMA）.When the mass fraction of microspheres is about 0.6%,the transmittance of composite material is 86.1% and the haze is 91.25%,the tensile strength reaches its maximum,namely 77.2 MPa,the bending strength is 87.2 MPa,the charpy notched impact strength is 2.16 kJ/m^2,the Izod notched impact strength is 2.71 kJ/m^2.The comprehensive properties of the composite material are excellent.
参考文献
| [1] | Liu SM;Lang XM;Ye H;Zhang SJ;Zhao JQ .Preparation and characterization of copolymerized aminopropyl/phenylsilsesquioxane microparticles[J].European Polymer Journal,2005(5):996-1001. |
| [2] | Miller CR;Vogel R;Surawski PPT;Jack KS;Corrie SR;Trau M .Functionalized organosilica microspheres via a novel emulsion-based route[J].Langmuir: The ACS Journal of Surfaces and Colloids,2005(21):9733-9740. |
| [3] | 陆馨,辛忠,李春.聚（甲基丙烯酸甲酯-CO-苯乙烯）/聚硅氧烷核壳微球的制备与应用[J].化工学报,2011(02):539-544. |
| [4] | Chang-Chung Yang;Wen-Chang Chen .The structures and properties of hydrogen silsesquioxane (HSQ) films produced by thermal curing[J].Journal of Materials Chemistry: An Interdisciplinary Journal dealing with Synthesis, Structures, Properties and Applications of Materials, Particulary Those Associated with Advanced Technology,2002(4):1138-1141. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%