在非导体表面化学沉积金属的开始,首先必须要有一种合适的引发剂,即是今天所谓的活化剂.从含有亚锡的酸性溶液中制取的胶体钯是活化剂的主要成分.总的来说,胶体钯催化剂的制备虽然简单,但要符合一些质量要求,就必须收集有关催化剂结构的详细数据.胶体钯催化剂的结构对胶体与被镀表面的反应及其活性均有影响.目前大多数催化剂是与加速剂联合使用,以引发化学镀镍溶液中金属的沉积.在直接镀工艺中,使用大量的催化剂所带来的导电性有利于后续的电镀.
To start the electroless metal deposition on a nonconductive surface, a suitable starter must be applied first. This so called activator today mainly consists of palladium colloids deposited from an acidic solution containing stannous tin. While manufacturing such catalyst is easy in general, today a lot of quality demands exist, which made it necessary to collect detailed information about the catalyst structure. This structure influences the reaction of the colloid with a surface and determines its activity. Most catalyst today is used in combination with an ′accelerator′ for starting metal deposition from an electroless nickel bath. A considerable amount is used for direct plating where the catalyst itself produces conductivity for subsequent electroplating.
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