通过600℃/2 h真空退火, 使复合电沉积的Ni-14.1 mass\%Al膜(平均粒径为1 μm)合金化, 获得一种新型细晶Ni3Al涂层. 对比研究了该涂层与粗晶Ni3Al合金900℃下50 h恒温氧化过程. 结果表明, 细晶涂层可快速生长连续Al2O3膜, 导致NiO的生长受到明显抑制. 与粗晶合金相比, 该氧化膜粘附性更强. 其原因可能在于氧化时细晶结构可抑制源自氧化膜的阳离子空位及Ni3Al中因Al、Ni的互扩散所致的“Kirkendall”空位在氧化膜/基体界面沉积形成孔洞, 提高了二者的结合强度.
A novel fine-grained Ni3Al coating was fabricated by annealing an electrodeposited Ni-14.1 mass%Al composite coating in vacuum at 600 ℃ for 2 h. Oxidation of the coating was compared to that of a coarse-grained Ni3Al alloy at 900 ℃ for 50 h and the result showed that the growth of NiO was significantly retarded on the coating because of a rapid formation of a continuous alumina scale. Moreover, the alumina scale on the coating was much adherent, because the existence of abundant grain boundaries in the coating inhibited the formation of cavities at the scale/metal interface due to condensation of cation vacancies injected from the growing scale and “Kirkendall” vacancies generated below scale because of the inter-diffusion between Al and Ni during oxidation.
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