采用霍尔槽法及电化学法研究了添加剂对镀层质量、镀液分散能力的影响. 结果表明随着添 加剂BSP、H1、PN、PEG加入量增大, 镀层光亮区和镀液分散能力均先增大后减小. X型光亮剂酸性镀铜新工艺适宜条件下可在20~40℃下得到光亮平整的镀层, 对应电流密度0.5~14.3 A/dm2. 施镀15 min, 镀液分散能力可达32.8%, 高于市售光亮剂的26.2%. X型光亮剂使铜沉积阴极峰电流由43 mA/cm2降低至24 mA/cm2, 峰电位负移60 mV. 镀层结晶细小致密, 且为面心立方Cu, 在(111)晶面择优取向.
The influence of additives on the dispersive ability of electrolytes for electrodeposition of Cu and the quality of the resulted Cu coatings was investigated using Hull Cell method and electrochemical technique. It was found that the bright area on Cu coatings and the dispersive ability of electrolytes increased firstly and decreased afterwards with the increase of additive concentrations of BSP, H1, PN, PEG. A bright, glossy and uniform coating could be obtained at 20~40℃ under appropriate conditions from the electrolyte containing X-type brightener. The current density was within a range 0.5~14.3 A/dm2. The dispersive ability of the electrolytes with X-type brightener reached 32.8%, which was much higher than the value of 26.2% of the commercial ones, after plating for 15min. Correspondingly, the cathodic peak current of copper electrodeposition decreased from 43 to 24 mA/cm2 and the peak potential shifted negatively by 60 mV. The grain size of coatings was superfine and the deposited Cu coatings possessed a preferential orientation (111).
参考文献
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