铈对SnAgCu钎料的显微组织和性能影响

中国稀土学报, 2009, 27(2): 246-250.

铈对SnAgCu钎料的显微组织和性能影响

张亮 ^1, , 薛松柏 ^2, , 曾广 ^3, , 皋利利 ^4, , 陈燕 ^5, , 盛重 ^6, , 禹胜林 ^7,

1.南京航空航天大学材料科学与技术学院,江苏,南京,210016

2.南京航空航天大学材料科学与技术学院,江苏,南京,210016

3.南京航空航天大学材料科学与技术学院,江苏,南京,210016

4.南京航空航天大学材料科学与技术学院,江苏,南京,210016

5.哈尔滨焊接研究所,黑龙江,哈尔滨,150080

6.南京航空航天大学材料科学与技术学院,江苏,南京,210016

7.南京航空航天大学材料科学与技术学院,江苏,南京,210016;中国电子科技集团第十四研究所,江苏,南京,210013

基金项目: 江苏省六大人才高峰项目(06-E-020) 江苏省普通高校研究生科技创新计划(CXD7B-087z) 南京航空航天大学大学生创新基金(2008011)

关键词：铈 , 无铅钎料 , 润湿性 , 抗拉强度 , 疲劳寿命 , 金属间化合物 , 稀土

Effects of Cerium on Microstructure and Properties of SnAgCu Solders

采用扫描电镜和能谱分析等测量方法,研究了微量铈对SnAgCu无铅钎料的润湿性、焊点抗拉强度、热疲劳性能和微观组织的影响.研究结果表明,添加微量的铈后,钎料的铺展面积明显增加,焊点抗拉强度得到明显提高,焊点热疲劳特性也得到很大的改善,但过量的铈会明显恶化钎料的此类性能.对AnAgCu-XCe焊点内部组织进行分析,发现微量铈可以明显细化焊点内部组织,降低金属问化合物层的厚度.

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