低熔玻璃广泛用作封接玻璃和电子浆料中的粘接相.现有低熔玻璃绝大部分为高铅含量玻璃.提出组成中不合PBb、Hg、Cd、As、Tl、Cr和放射性元素的玻璃称为组成无公害玻璃,综述了低熔玻璃的发展现状,指出电子产品目前所用含铅玻璃的取代物可能是磷酸盐、矾酸盐、铋酸盐玻璃.建立磷酸盐、矾酸盐、铋酸盐玻璃相关基础理论,发展玻璃形成新理论以及新的材料制备技术是组成无公害低熔玻璃研究与开发的重点.
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