采用对接方式对2 mm厚的T2紫铜板和2 mm厚的2A16铝合金板进行真空电子束焊。通过力学拉伸研究焊接速度、电子束流、扫描幅值对接头力学性能的影响，通过电镜扫描观察接头的显微组织形貌。结果表明：接头抗拉强度随着焊接速度、电子束流、扫描幅值的增大均呈先增大后减小的趋势；当焊接速度为1800 mm/min，电子束流为62 mA，扫描幅值为0.8 mm时抗拉强度达到最大值71 MPa。电子束流固有的冲击搅拌作用和其O型扫描作用对熔池中心组织有细化作用，会促进等轴块状相的生成，抑制组织的棒状生长。在熔池中心，各相的分布均匀，白色的网状化合物Al2Cu相遍布熔池中，暗灰色的Al相呈等轴块状被包裹在网状相的内部；靠铝侧热影响区相呈短棒状，紧靠铜侧的化合物层为Al2Cu层。
2.0 mm-thick T2 copper and 2.0 mm-thick 2A16 aluminum were welded by vacuum electron beam welding machine.The effects ofwelding velocity, electron beam and scanningmagnitudeonthe mechanical propertieswere studiedthrough the mechanical tensile.The microstructure of the joint was studied by SEM.The results show that, the tensile strength of joint increasesfirstlythen decreaseswith increasingthewelding speed, electron beam and the magnitude of scanning. When the welding speedis1800 mm/min,theelectron beam currentis62 mA, the magnitude of scanningis0.8 mm, the tensile strength reachesthe maximum of 71 MPa. The stirring action and O-scan of electron beam refine themicrostructureof molten pool and promotethe appearance of equiaxial massive phase. Each phase distributesuniformly in the pool. White Al2Cu compoundsarereticular in the center of molten pool. The dark gray Al phaseiswrapped by Cu-Al compounds andpresented equiaxed block. Phase near the HAZ of aluminum side is short rod. The compound layer close to the side of the copperisAl2Cu layer.
参考文献
| [1] | 黄伯云.我国有色金属材料现状及发展战略[J].中国有色金属学报,2004(z1):122-127. |
| [2] | 张满.铝/铜异种材料焊接的研究现状[J].热加工工艺,2009(09):116-119,122. |
| [3] | 刘会杰;沈俊军.铝/铜异种材料的焊接研究[J].焊接,2009(3):14-18. |
| [4] | 冯吉才;王廷;张秉刚;陈国庆.异种材料真空电子束焊接研究现状分析[J].焊接学报,2009(10):108-112. |
| [5] | 夏春智;李亚江;王娟.Cu/Al异种金属连接的研究现状[J].焊接,2008(1):17-20. |
| [6] | 刘铁;张文金;陈启健.Cu-Al的搅拌摩擦焊工艺和性能研究[J].热加工工艺,2015(1):224-225,231. |
| [7] | 李亚江;吴会强;陈茂爱;杨敏;冯涛.Cu/Al真空扩散焊接头显微组织分析[J].中国有色金属学报,2001(3):424-427. |
| [8] | 薛志清;胡绳荪;左迪;申俊琦.铜铝异种金属激光焊接头组织特征及力学性能[J].焊接学报,2013(10):51-54. |
| [9] | Jiahu Ouyang;Eswar Yarrapareddy;Radovan Kovacevic.Microstructural evolution in the friction stir welded 6061 aluminum alloy (T6-temper condition) to copper[J].Journal of Materials Processing Technology,20061(1):110-122. |
| [10] | Ji Feng;Xue Songbai;Dai Wei.Reliability studies of Cu/Al joints brazed with Zn-Al-Ce filler metals[J].Materials & design,2012Dec.(Dec.):156-163. |
| [11] | 李东;赵杨洋;张延松.焊接能量对铝/铜超声波焊接接头显微组织的影响[J].焊接学报,2014(2):47-50. |
| [12] | 董红刚;张旭超;杨继承;胡文金.铝合金/黄铜异种金属电弧熔钎焊[J].中国机械工程,2014(8):1122-1125. |
| [13] | 罗乾.Cu/Al合金异种材料复合管电阻压焊接头连接特性分析[J].热加工工艺,2010(07):115-116,119. |
| [14] | 刘政;周翔宇.分级电磁搅拌对半固态Al-Cu合金凝固组织的影响[J].中国有色金属学报,2015(1):49-57. |
| [15] | 彭迟;程东海;陈益平;胡德安.铝/铜异种材料填丝钨极氩弧焊对接接头的组织和性能[J].中国有色金属学报,2015(4):975-981. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%