针对连铸过程中时常发生的坯壳和结晶器铜板壁黏结情况，分析了保护渣性能、结晶器流场、保护渣充填操作、中间包温度、钢水纯净度等造成黏结的各种因素，通过采取相应措施，大大减少了黏结情况。
On the basis of the process for continuous casting of slab continuous casting frequent copper shell and mold wall bond, flux, mold flow, mold flux filling operation, tundish temperature, molten steel purity and other factors caused by bonding were analyzed. The bonding situation was reduced significantly by taking appropriate measures.
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