用扫描电镜(SEM)研究了Cu与液态Sn的相互作用。观察到了350℃时Cu_6Sn_5的生长突跃和Sn层中化合物生长的形态。以及Sn-Pb合金中随Pb含量增加Cu_6Sn_5生长趋势减弱。
The features of Cu_6Sn_s, growing slowly at lower temperature and growing rapidly up over 350℃, and of Cu_3Sn, growing at higher temperature, have been detailedly observed under SEM. The increase of Pb content seems to inhibit sequentially the growth of Cu_6Sn_5 in Sn-Pb alloy.
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