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以纯铜为研究对象,通过添加镍粉进行表面机械研磨(SMAT)处理.用光学显微镜(OM)、X射线衍射分析仪(XRD)和扫描电镜(SEM)对SMAT处理后样品的组织及成分变化进行分析.采用X射线能量色散谱分析方法(EDS)分析Ni元素在合金层中的分布与含量.结果表明,纯铜表面出现了明显的分层现象,同时铜镍发生互扩散有铜镍合金形成.处理120 min后形成厚度为35μm铜镍合金层,而240 min厚度则达到55μm,并且合金层与基体变形层结合紧密.由于弹丸的冲击产生应力应变和大量储存能,使得原子的跳动频率增加同时降低了扩散激活能,实现铜镍在较低温度下快速互扩散.

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