In order to achieve the optimum conditions for electroplating nanocrystalline nickel coating from Watts-type bath, the effect of some process parameters namely, bath temperature, current density, and saccharin addition on grain size and texture coefficient (TC= I(200) /I(111) ) of the deposits were investigated by X-ray diffraction
(XRD). The results showed that in a bath containing 5 g/L saccharin, by increasing the bath temperature from 45°C to 55°C, the grain size decreased, whereas further increase of bath temperature resulted in a contrary effect. By increasing the current density from 10 to 75 mA/cm2, both the grain size and TC decreased, while further increase in current density had no significant effect on the grain size. At a given current density, the grain size and TC decreased rapidly by increasing the saccharin content before leveling off at 3 g/L of saccharin. Finally, based on the grain refining the optimum conditions for producing nanocrystalline nickel coating from Watts-type bath have been proposed.
参考文献
| [1] | |
| [2] | S.C. Tjong and H. Chen: Mater. Sci. Eng, 2004, R45, 1.[2]H. Natter and R. Hempelmann: Z. Phys. Chem., 2008, 222, 319.[3] A. M.El-Sherik and U. Erb: J. Mater. Sci, 1995, 30, 5743. [4] I. Bakonyi, E. Toth-Kadar, L. Pogany, A. Cziraki, I.Gerocs, K. Varga-Josepovits, B. Arnold and K. Wetig: Surf. Coat. Technol, 1996, 78, 124.[5] I. Bakonyi, E. Toth-Kadar, T. Tarnoczi, L.K. Varga, A. Cziroki, I. Gerocs and B. Fogarassy: Nanostruct. Mater, 1993, 3, 155.[6] F. Ebrahimi and Z. Ahmed: J. Appl. Electrochem, 2003, 33, 733.[7]K.L. Morgan, Z. Ahmed and F. Ebrahimi: MRS Proc., 2001, 634, B3.11.1.[8]P.Q. Dai, Hui Yu and Q. Li: Trans. Mater. Heat Treatment, 2004, 25, 1283. (in Chinese)[9]R.T.C. Choo, J. M. Toguri, A. M. El-Sherik and U. Erb: J. Appl. Electrochem., 1995, 25, 384.[10] S.T. Aruna, S. Diwakar, A. Jain and K.S. Rajam: Surf. Eng, 2005, 21, 209.[11] X.T. Yuan, Y. Wang, D.B. Sun and H.Y. Yu: Surf. Coat. Technol, 2008, 202, 1895.[12]M. Paunovic and M. Schlesinger: Fundamentals of Electrochemical Deposition, Wiley-Interscience Publication, John Wiley Sons, Inc., 1998, 197.[13] T. Ungar, J. Gubicza, G. Ribarik and A. Borbely: J. Appl. Cryst, 2001, 34, 298.[14] T. Ungar, I. Dragomir, A. Revesz and A. Borbely: J. Appl. Cryst, 1999, 32, 992.[15]J. Panek, A. Budniok and E. Lagiewka: Rev. Adv. Mater. Sci., 2007, 15, 234.[16] J. Panek and A. Budniok: Surf. Coat. Technol, 2007, 201, 6478.[17] R. Weil and H.C. Cook: J. Electrochem. Soc, 1962, 109, 295.[18]Y. Nakamura, N. Kaneko, M. Watanabe and H. Nezu: J. Appl. Electrochem., 1994, 24, 227.[19]J.K. Denis and J.J. Fuggle: Electroplat. Metal Fin., 1967, 20, 370.[20]J.K. Denis and J.J. Fuggle: Electroplat. Metal Fin., 1968, 21, 16.[21]J.W. Dini: Electrodeposition: The Material Scienceof Coatings and Substrates, Noyes Publications, New Jersey, 1993, 141.[22]J.W. Dini: Plat. Surf. Finish., 1988, 75, 11.[23] H. Natter and R. Hempelmann: Electrochim. Acta, 2003, 49, 51.[24]A. Milchev: Electrocrystallization, Fundamentals of Nucleation and Growth, Kluwer Academic Publishers, 2002, 11.[25] E. Budevski, G. Staikov and W.J. Lorenz: Electrochim. Acta, 2000, 45, 2559.[26]J.W.P. Schmelzer: Mater. Phys. Mech., 2003, 6, 21.[27] J. Vazquez-Arenas, R. Cruz and L.H. MendozaHuizar: Electrochim. Acta, 2006, 52, 892.[28] A. Cziraki, B. Fogarassy, I. Gerocs, E. Toth-Kadar and I. Bakonyi: J. Mater. Sci, 1994, 29, 4771.[29] K. Haug and T. Jenkins: J. Phys. Chem. B, 2000, 104, 10017.[30] A.M. Rashidi and A. Amadeh: Surf. Coat. Technol, 2008, 202, 3772.[31]J.P. Bonino, P. Pouderoux, C. Rossignol and A. Rousset: Plat. Surf. Finish., 1992, 79, 62.[32]T.C. Franklin: Plat. Surf. Finish, 1994, 84, 62.[33] D. Mockute and G. Bernotiene: Surf. Coat. Technol, 2000, 135, 42.[34] A. Ciszewski, S. Posluszny, G. Milczarek and M. Baraniak: Surf. Coat. Technol, 2004, 183, 127.[35] B. Szeptycka: Russ. J. Electrochem, 2001, 37, 684.[36] C.C. Roth and H. Leidheiser: J. Electrochem. Soc, 1953, 100, 553.[37]J. Edwards: Trans. Inst. Metal Fin., 1964, 41, 169. |
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