含硅芳炔树脂是一种新型的耐高温热固性树脂,具有优异的耐热性能、优良的介电性能、高温力学性能和优异的工艺性能,广泛应用于航空航天、电子信息领域.本文用热失重方法(TGA)研究了含硅芳炔树脂的热氧化降解动力学.结果显示含硅芳炔树脂的热氧化降解过程分为三个阶段,热氧化增重阶段、热氧化降解阶段Ⅰ、热氧化降解阶段Ⅱ.采用Ozawa和Kissinger方法分析了含硅芳炔树脂热氧化降解的三个阶段的活化能、反应级数、频率因子等动力学参数.
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