采用硅橡胶(110型)与金属(Ni粉)按质量比1:2配料,经过特殊的制备工艺,合成金属Ni/硅橡胶高分子复合材料.分别测量样品的压敏效应和介电特性.结果表明:在不同应力作用下,样品的电阻从1×1012Q降到10 Ω,其变化范围为11个数量级;在恒应力作用下,样品的电阻随时间的增加而减小,表现出"电阻蠕动"现象;室温下,样品的电容和介电损耗都随频率的增加而减小,随应力的增加而增大,其原因是在样品中形成了以高分子为绝缘层、金属Ni粉为导电填料的相互隔离且平行的超电容网络微观结构.在外力作用下,这种微观结构中每一个电容单元的间距逐渐减小而电容逐渐增大,致使样品的电容有大幅度增加;介电损耗是由于样品的电阻率减小,电导增大,使部分电能转化为热能.
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