研究了Cu-11.5%Fe合金经固溶和时效处理后导电性的变化规律. 采用SEM和TEM观察了经不同规范热处理Cu-11.5%Fe合金的组织结构, 利用XRD测定了铜基体的晶格常数, 得出时效处理对合金电阻率的影响规律, 并探讨了合金电阻率变化的内在原因. 结果表明: 影响合金导电性的主要因素是溶质散射电阻、析出应变场散射电阻; 固溶处理的合金经过550.℃、 2.h时效处理, 可得到较低的电阻率.
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