选用A、B两种不同粒度的W粉,调节A、B钨粉的比例,并与Cu粉直接混合,配制成W/Cu20(质量分数%,下同)混合粉末,经热压制备了近全致密的W-Cu复合材料.显微组织观察表明,随着小粒度W粉配比的增加,大W颗粒形成的孔隙逐渐减少,而小W颗粒形成的孔隙逐渐增加.当W粒度配比为80%A+20%B时,形成较为致密的堆积结构.在合适的工艺条件下(烧结温度1060 ℃、压力85 MPa、保温3 h),所制备的W/Cu20复合材料其相对密度达到98.6%,Cu相沿大W颗粒和小W颗粒的边界呈现网状分布.
In order to fabricate highly dense W/Cu20 (mass fraction, similarly hereinafter) composite materials, two kinds of tungsten powder with different particle size, A and B, were used. The W powder with different ratios of A and B were directly mixed with copper powder and W/Cu20 mixed powder was obtained. Almost fully dense W-Cu composite materials were fabricated by solid-state hot pressing. The observation of microstructure shows that with increasing of the fine W powder (B) content, the pores formed by the coarse W powder (A) decrease and the pores by the fine W powder increase gradually. Rather dense microstructure is obtained when the W particle distribution is 80%A+20%B. The W/Cu20 with 98.6% relative density is obtained under the processing conditions of sintering temperature of 1060 °C, pressure of 85 MPa and holding time of 3 h. Copper forms into a network structure around the coarse W particles and the fine W particles.
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