Formation of Bulk Intermetallic Compound Ag3Sn in Slowly-Cooled Lead-Free Sn-4.0 wt pct Ag Solders

材料科学技术（英文）, 2005, 21(6): 827-830.

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1.College of Materials Science & Engineering, Tianjin University, Tianjin 300072, China

2.College of Materials Science & Engineering, Tianjin University, Tianjin 300072, China

3.College of Materials Science & Engineering, Tianjin University, Tianjin 300072, China

4.College of Materials Science & Engineering, Tianjin University, Tianjin 300072, China

5.College of Materials Science & Engineering, Tianjin University, Tianjin 300072, China

基金项目: 国家自然科学基金(033608811) the Foundation for theAuthor of National Excellent Doctoral Dissertation of China(200335) 中国科学院资助项目(50401033) the Scientific Research Foundation for the Returned Overseas Chinese Scholars,State Education Ministry

Formation of Bulk Intermetallic Compound Ag3Sn in Slowly-Cooled Lead-Free Sn-4.0 wt pct Ag Solders

Keywords： Lead-free solder

Sn-Ag alloy system has been regarded as one of the most promising lead-free solder to substitute conventional Sn-Pb eutectic solder. But the formation of bulk Ag3Sn intermetallic compounds (IMCs) during reflow and post heat treatment significantly influences the performance of the solder joints. With an effort to clarify its microstructural evolution as a function of slow cooling rates, the fraction of bulk IMCs within the slowly solidified Sn-4.0 wt pct Ag solder was investigated by standard metallographic and compared with that detected by thermal analysis. It was found that the bulk IMCs fraction determined by thermal analysis corresponds quite well with the microstructure observation results. In accordance with the conventional solidification theory, the lower the applied cooling rate, the fewer the amount of bulk Ag3Sn IMCs formed in Sn-4.0 wt pct Ag alloy. In addition, Vickers hardness measurement results indicated that the relative coarse eutectic Ag3Sn IMCs distributing in the lamellar eutectic structure favored the improvement of the mechanical performance.

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Formation of Bulk Intermetallic Compound Ag3Sn in Slowly-Cooled Lead-Free Sn-4.0 wt pct Ag Solders

参考文献